ORLANDO, Fla., April 24, 2025 –Fonon Technologies, a marketing and systems integration provider of state-of-the-art laser technologies for material processing and defense infrastructures, today announced the launch of its advanced wire processing system – the DTWP-6010. It is a fully automated laser-powered machine for optimized wire harness board assembly that strips, marks, and cuts wires of various gauges, setting a new standard for efficiency and reliability in critical applications.
“Fonon Technologies is committed to providing systematic advancements to our defense partners,” said Bryan Lee, Vice President of Fonon Technologies. “The integration of high-precision laser technology into critical wire prep operations and MRO processes presents a tangible and real world improvement in harness board assembly capabilities. By ensuring accurate wire processing within defense systems, we contribute directly to enhanced reliability and reduced downtime. This capability allows us to better serve the needs of the defense market and expand our collaborations.”
Non- laser technology offers an innovative method of non-damaging, exceptionally precise processing of wires. The DefenseTech Wire Processor 6010 (DTWP-6010) is a TAA-compliant system purpose-built to meet the rigorous demands of MRO and manufacturing in the defense and government sectors. This comprehensive 3-in-1 solution tackles multiple tasks essential in wire harness board assembly – from producing permanent, high-contrast markings on diverse wire insulation materials to the selective stripping of insulation. This fully automated system integrates UV and CO2 laser types and is complete with either mechanical or laser cutting of wires at precise lengths. The system can be tailored to address specific maintenance, repair, and overhaul (MRO) requirements.